Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5313094 | Thermal dissipation of integrated circuits using diamond paths | Klaus D. Beyer, Chang-Ming Hsieh, Louis L. Hsu, David E. Kotecki | 1994-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5313094 | Thermal dissipation of integrated circuits using diamond paths | Klaus D. Beyer, Chang-Ming Hsieh, Louis L. Hsu, David E. Kotecki | 1994-05-17 |