Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5431324 | Ultrasonic bonding apparatus and quality monitoring method | Ryoichi Kajiwara, Mituo Katou, Kazuya Takahashi, Minoru Maruta, Kunihiro Tsubosaki | 1995-07-11 |
| 5323952 | Bonding apparatus and testing apparatus of a bonded portion | Mituo Kato, Ryoichi Kajiwara, Kazuya Takahashi, Setuo Sekine | 1994-06-28 |
| 4796132 | Thin film magnetic head having Au ultrasonic connection structure | Yoshinori Dekura, Kazuhiro Momata | 1989-01-03 |