TH

Tomoko Higashino

RE Renesas Electronics: 6 patents #669 of 4,529Top 15%
RT Renesas Technology: 5 patents #592 of 3,337Top 20%
HC Hitachi Ulsi Systems Co.: 4 patents #214 of 867Top 25%
HI Hitachi: 2 patents #13,388 of 28,497Top 50%
HC Hitachi Chemical Company: 1 patents #1,071 of 1,946Top 60%
Overall (All Time): #380,638 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
10002808 Semiconductor device manufacturing method and semiconductor device Yoshiyuki Abe, Chuichi Miyazaki, Hideo Mutou 2018-06-19
9070560 Semiconductor chip with modified regions for dividing the chip Yoshiyuki Abe, Chuichi Miyazaki, Hideo Mutou 2015-06-30
9006036 Method of manufacturing semiconductor device Yuichi Morinaga, Kazuya Tsuboi, Tamaki Wada 2015-04-14
8772135 Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof Yoshiyuki Abe, Chuichi Miyazaki, Hideo Mutou 2014-07-08
8084334 Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region Yoshiyuki Abe, Chuichi Miyazaki, Hideo Mutou 2011-12-27
7892949 Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region Yoshiyuki Abe, Chuichi Miyazaki, Hideo Mutou 2011-02-22
7563642 Manufacturing method of a semiconductor device 2009-07-21
7514294 Semiconductor device and a manufacturing method of the same Chuichi Miyazaki, Yoshiyuki Abe 2009-04-07
7148081 Method of manufacturing a semiconductor device Kazunari Suzuki, Chuichi Miyazaki 2006-12-12
6916686 Method of manufacturing a semiconductor device Takashi Wada, Kazunari Suzuki, Chuichi Miyazaki, Toshihiro Shiotsuki 2005-07-12
6750080 Semiconductor device and process for manufacturing the same Masachika Masuda, Tamaki Wada, Michiaki Sugiyama, Takafumi Nishita, Hiroshi Ohno 2004-06-15
6552437 Semiconductor device and method of manufacture thereof Masachika Masuda, Tamaki Wada, Michiaki Sugiyama, Takafumi Nishita, Hiroshi Ohno 2003-04-22
6445076 Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same Takehiro Shimizu, Takafumi Dohdoh, Kazumi Tameshige, Hidekazu Matsuura, Yoshihiro Nomura +3 more 2002-09-03