Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12415820 | Method for post-synthetic modification of metal-organic frameworks for enhancing hydrophilicity and water stability of metal-organic frameworks in water sorption | Michael Tsapatsis, Zhiyong Xia | 2025-09-16 |
| 12243849 | Passives to facilitate mold compound flow | Chittranjan Mohan Gupta, Yiqi Tang, Rajen Manicon Murugan, Jie Chen | 2025-03-04 |
| 12243809 | Packaged electronic device with film isolated power stack | Jonathan Almeria Noquil, Osvaldo Jorge Lopez | 2025-03-04 |
| 12176274 | Multi-die package with multiple heat channels | Jonathan Almeria Noquil, Osvaldo Jorge Lopez | 2024-12-24 |
| 11930590 | Stress relief for flip-chip packaged devices | Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Bernardo Gallegos | 2024-03-12 |
| 11817375 | High I/O density flip-chip QFN | Osvaldo Jorge Lopez, Jonathan Almeria Noquil | 2023-11-14 |
| 11658130 | Conductive plate stress reduction feature | Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez, Lance Cole Wright | 2023-05-23 |
| 11640932 | Packaged electronic device with film isolated power stack | Jonathan Almeria Noquil, Osvaldo Jorge Lopez | 2023-05-02 |
| 11024564 | Packaged electronic device with film isolated power stack | Jonathan Almeria Noquil, Osvaldo Jorge Lopez | 2021-06-01 |
| 9625148 | Device for use in burner and method for manufacturing the same | Yingzhi WANG | 2017-04-18 |