Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698117 | Die bonding apparatus | Yongdae Ha, Jaeryoung Lee, Chulmin KIM, Yisung Hwang, Yongjin Jung | 2017-07-04 |
| 9024649 | Insert for semiconductor package and testing apparatus with the same | Guiheum Choi, Minsu Kang, Seunghee Lee | 2015-05-05 |
| 8939784 | Test socket having a housing with clamping devices to connect the housing to a floating guide | Sangki Lee, Insik Kim, Suklae Kim, Yoonoh Han | 2015-01-27 |