Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7560372 | Process for making a semiconductor device having a roughened surface | Hiroaki Tomimori, Hidemitsu Aoki, Kaoru Mikagi, Akira Furuya | 2009-07-14 |
| 7170172 | Semiconductor device having a roughened surface | Hiroaki Tomimori, Hidemitsu Aoki, Kaoru Mikagi, Akira Furuya | 2007-01-30 |
| 6756685 | Semiconductor device | — | 2004-06-29 |
| 6432807 | Method of forming solder bumps on a semiconductor device using bump transfer plate | Hiroyuki Tsukui, Chikara Yamashita | 2002-08-13 |
| 6410981 | Vented semiconductor device package having separate substrate, strengthening ring and cap structures | — | 2002-06-25 |