TY

Taro Yoshida

Samsung: 9 patents #14,526 of 75,807Top 20%
FC Fujimori Kogyo Co.: 2 patents #30 of 112Top 30%
MC Mitsubishi Gas Chemical Company: 1 patents #1,048 of 1,727Top 65%
ML Mitsubishi Paper Mills Limited: 1 patents #256 of 458Top 60%
Overall (All Time): #401,431 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11895759 Induction heating apparatus Masashi SASAGAWA, Masaki Ono, Masayuki Otawara, Nobuharu NISHIKOORI, Tomoyuki KANAGAWA +1 more 2024-02-06
11800606 Induction heating cooker Masashi SASAGAWA, Masayuki Ohtawara, Nobuharu NISHIKOORI, Tomoyuki KANAGAWA, Yutaka Yagi +1 more 2023-10-24
11751291 Induction heating apparatus Tomoyuki KANAGAWA, Masaki Ono, Masashi SASAGAWA, Masayuki Otawara, Nobuhara Nishikoori +1 more 2023-09-05
11008693 Washing machine and control method of the same Hidekazu Funakoshi, Tomonori Ueno, Yukinori Nakagawa, Hiroshi Katsumoto, Yasuyuki Sonoda +2 more 2021-05-18
10954621 Washing machine and motor Tomonori Ueno, Hiroshi Katsumoto, Hidekazu Funakoshi, Yukinori Nakagawa, Yasuyuki Sonoda +2 more 2021-03-23
10804823 Motor and washing machine having the same Tomonori Ueno, Hiroshi Katsumoto, Hidekazu Funakoshi, Yukinori Nakagawa, Yasuyuki Sonoda +2 more 2020-10-13
10202042 Electric vehicle power conversion system Futoshi YAMANE, Masami Ishikawa, Mitsutoshi Muraoka, Yoshinari Murayama, Kenji Furusawa 2019-02-12
10046646 Power conversion system for electric vehicles Futoshi YAMANE, Masami Ishikawa, Yoshinari Murayama, Mitsutoshi Muraoka, Kenji Furusawa 2018-08-14
9403438 Control device for hybrid vehicle and control method for hybrid vehicle Futoshi YAMANE, Masami Ishikawa, Yoshinari Murayama, Mitsutoshi Muraoka, Kenji Furusawa 2016-08-02
7749620 Electromagnetic wave shield material and process for producing the same Atsushi Suzuki, Yasuo Tsubai, Kazuhisa Kobayashi 2010-07-06
6736988 Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board Morio Gaku, Nobuyuki Ikeguchi, Yoshihiro Kato 2004-05-18
4692327 Laminated film for packaging Toru Takahashi 1987-09-08