Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781870 | Wire bond and redistribution layer process | Mitchell M. Hamamoto, Chen Gao | 2010-08-24 |
| 7456496 | Package design and method of manufacture for chip grid array | Roman Perez, Kee Kwang Lau, Alex Chew, Antonio B. Dimaano, Jr. | 2008-11-25 |
| 6929981 | Package design and method of manufacture for chip grid array | Roman Perez, Kee Kwang Lau, Alex Chew, Antonio B. Dimaano, Jr. | 2005-08-16 |
| 6750082 | Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip | John Briar, Roman Perez | 2004-06-15 |
| 6734039 | Semiconductor chip grid array package design and method of manufacture | Roman Perez, Kee Kwang Lau, Alex Chew, Antonio B. Dimaano, Jr. | 2004-05-11 |
| 6510976 | Method for forming a flip chip semiconductor package | Romeo Emmanuel P. Alvarez | 2003-01-28 |