Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10905008 | Wiring board | Takahiro Hayashi | 2021-01-26 |
| 9237656 | Method of manufacturing multi-layer wiring board | Shinnosuke MAEDA, Tetsuo Suzuki, Atsuhiko Sugimoto, Satoshi Hirano, Hajime Saiki | 2016-01-12 |
| 9119333 | Multilayer wiring board | Masahiro Inoue, Hajime Saiki, Atsuhiko Sugimoto, Hidetoshi Wada | 2015-08-25 |
| 8866025 | Multilayer wiring board | Masahiro Inoue, Hajime Saiki, Atsuhiko Sugimoto, Hidetoshi Wada | 2014-10-21 |
| 8707554 | Method of manufacturing multilayer wiring substrate | Shinnosuke MAEDA, Tetsuo Suzuki, Tatsuya Ito, Satoshi Hirano, Atsuhiko Sugimoto | 2014-04-29 |
| 8581388 | Multilayered wiring substrate | Shinnosuke MAEDA, Tetsuo Suzuki, Atsuhiko Sugimoto, Tatsuya Ito, Satoshi Hirano | 2013-11-12 |
| 8233289 | Multilayer wiring substrate and method for manufacturing the same | Shinnosuke MAEDA, Toshiya Asano | 2012-07-31 |
| 8143534 | Wiring board having solder bump and method for manufacturing the same | Hajime Saiki, Kazutaka Tanaka | 2012-03-27 |
| 6391422 | Wiring substrate and stiffener therefor | Seiji Mori | 2002-05-21 |