Issued Patents All Time
Showing 1–25 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848214 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner | 2023-12-19 |
| 11094560 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner | 2021-08-17 |
| 11081370 | Methods of manufacturing an encapsulated semiconductor device | Ronald Patrick Huemoeller, David Jon Hiner | 2021-08-03 |
| 10811277 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner | 2020-10-20 |
| 10665567 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2020-05-26 |
| 10586746 | Semiconductor device and method | — | 2020-03-10 |
| 10461006 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner | 2019-10-29 |
| 10354907 | Releasable carrier method | — | 2019-07-16 |
| 10332775 | Releasable carrier and method | — | 2019-06-25 |
| 9941146 | Semiconductor device and method | — | 2018-04-10 |
| 9922949 | Semiconductor device and method | — | 2018-03-20 |
| 9871015 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2018-01-16 |
| 9847244 | Semiconductor device and method | — | 2017-12-19 |
| 9812386 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, David Jon Hiner | 2017-11-07 |
| 9691635 | Buildup dielectric layer having metallization pattern semiconductor package fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2017-06-27 |
| 9406645 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2016-08-02 |
| 9060430 | Shielded trace structure and fabrication method | Ronald Patrick Huemoeller, Nozad Karim | 2015-06-16 |
| 9054117 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2015-06-09 |
| 8952522 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2015-02-10 |
| 8826531 | Method for making an integrated circuit substrate having laminated laser-embedded circuit layers | David Jon Hiner, Ronald Patrick Huemoeller | 2014-09-09 |
| 8710649 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2014-04-29 |
| 8691632 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2014-04-08 |
| 8486764 | Wafer level package and fabrication method | Ronald Patrick Huemoeller, David Razu | 2013-07-16 |
| 8383950 | Metal etch stop fabrication method and structure | Ronald Patrick Huemoeller, Robert Francis Darveaux | 2013-02-26 |
| 8341835 | Buildup dielectric layer having metallization pattern semiconductor package fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2013-01-01 |