Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176308 | Package substrate and semiconductor package including the same | Youngkyu Lim, Gookmi Song | 2024-12-24 |
| 11756908 | Package substrate including a redistribution pad extending from a redistribution layer and including segmenting grooves along a redial direction thereof and semiconductor package including the same | Youngkyu Lim, Gookmi Song | 2023-09-12 |
| 11302661 | Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same | Youngkyu Lim, Gookmi Song | 2022-04-12 |
| 11264339 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Gyujin Choi, Sunghoan Kim, Changeun Joo, Chilwoo KWON, Youngkyu Lim | 2022-03-01 |