Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388000 | Semiconductor package including redistribution pattern | Dahee KIM | 2025-08-12 |
| 12176308 | Package substrate and semiconductor package including the same | Youngkyu Lim, Sunguk LEE | 2024-12-24 |
| 11894333 | Semiconductor package | Dahee KIM, Jeongrim Seo | 2024-02-06 |
| 11756908 | Package substrate including a redistribution pad extending from a redistribution layer and including segmenting grooves along a redial direction thereof and semiconductor package including the same | Youngkyu Lim, Sunguk LEE | 2023-09-12 |
| 11302661 | Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same | Youngkyu Lim, Sunguk LEE | 2022-04-12 |