Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990439 | Semiconductor package including under bump metallization pad | Jaeean Lee, Changeun Joo | 2024-05-21 |
| 11978696 | Semiconductor package device | Jae Ean LEE, Changeun Joo | 2024-05-07 |
| 11972966 | Method of manufacturing a semiconductor package including correcting alignment error while forming redistribution wiring struture | Changeun Joo | 2024-04-30 |
| 11961812 | Semiconductor packages having vias | Changeun Joo | 2024-04-16 |
| 11810864 | Semiconductor package | Changeun Joo | 2023-11-07 |
| 11587898 | Semiconductor packages having vias | Changeun Joo | 2023-02-21 |
| 11373955 | Semiconductor package and method of manufacturing the semiconductor package | Changeun Joo | 2022-06-28 |
| 11264339 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Sunghoan Kim, Changeun Joo, Chilwoo KWON, Youngkyu Lim, Sunguk LEE | 2022-03-01 |