Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728283 | Package substrate and semiconductor package including the same | Jeongseok Kim, Junggon Choi | 2023-08-15 |
| 11264339 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Gyujin Choi, Sunghoan Kim, Changeun Joo, Youngkyu Lim, Sunguk LEE | 2022-03-01 |
| 10985091 | Semiconductor package | Daeyeun Choi, Jaemok JUNG, Eunjin Kim | 2021-04-20 |