Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044553 | Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor | Alan S. Chen, Taeho Kook, Kurt G. Steiner, Timothy Daniel | 2011-10-25 |
| 6402590 | Carrier head with controllable struts for improved wafer planarity | Edward A. Rietman | 2002-06-11 |