Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848257 | Bending semiconductor chip for connection at different vertical levels | Paul Westmarland | 2023-12-19 |
| 11393743 | Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation | Chee Yang Ng, Josef Maerz, Clive O'Dell, Mark Pavier | 2022-07-19 |
| 10319620 | Common procedure of interconnecting electronic chip with connector body and forming the connector body | — | 2019-06-11 |
| 8865587 | Multi-chip-scale package | — | 2014-10-21 |
| 8525334 | Semiconductor on semiconductor substrate multi-chip-scale package | — | 2013-09-03 |