Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7924572 | Control device and method of manufacturing thereof | Takuya Mayuzumi, Masahiro Sasaki, Kiyoomi Kadoya | 2011-04-12 |
| 7554039 | Electronic device | Takehide Yokozuka, Masahide Harada, Shiro Yamashita, Kaoru Uchiyama, Masahiko Asano +1 more | 2009-06-30 |
| 7530819 | Device for controlling a vehicle | Masahiko Asano, Yasuo Akutsu, Kunito Nakatsuru, Kaoru Uchiyama | 2009-05-12 |
| 7445455 | Electronic device | Takehide Yokozuka, Masahide Harada, Shiro Yamashita, Isamu Yoshida, Masahiko Asano +2 more | 2008-11-04 |
| 7359212 | Control device and method of manufacturing thereof | Takuya Mayuzumi, Masahiro Sasaki, Kiyoomi Kadoya | 2008-04-15 |
| 7303406 | Device for controlling a vehicle | Masahiko Asano, Yasuo Akutsu, Kunito Nakatsuru, Kaoru Uchiyama | 2007-12-04 |
| 7217992 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device | Masahiko Ogino, Takumi Ueno, Akira Nagai, Toshiya Satoh, Toshiaki Ishii +5 more | 2007-05-15 |
| 7202570 | Circuit tape having adhesive film semiconductor device and a method for manufacturing the same | Akira Nagai, Masahiko Ogino, Masanori Segawa, Toshiak Ishii, Nobutake Tsuyuno +9 more | 2007-04-10 |
| 7091620 | Semiconductor device and manufacturing method thereof | Chuichi Miyazaki, Yukiharu Akiyama, Masnori Shibamoto, Tomoaki Kudaishi, Ichiro Anjoh +11 more | 2006-08-15 |
| 7038325 | Wiring tape for semiconductor device including a buffer layer having interconnected foams | Masahiko Ogino, Akira Nagai, Takumi Ueno, Masanori Segawa, Hiroyoshi Kokaku +6 more | 2006-05-02 |
| 7018218 | Device for controlling a vehicle | Masahiko Asano, Yasuo Akutsu, Kunito Nakatsuru, Kaoru Uchiyama | 2006-03-28 |
| 6940162 | Semiconductor module and mounting method for same | Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2005-09-06 |
| 6888230 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device | Masahiko Ogino, Takumi Ueno, Akira Nagai, Toshiya Satoh, Toshiaki Ishii +5 more | 2005-05-03 |
| 6861294 | Semiconductor devices and methods of making the devices | Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda +5 more | 2005-03-01 |
| 6791194 | Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same | Akira Nagai, Masahiko Ogino, Masanori Segawa, Toshiak Ishii, Nobutake Tsuyuno +9 more | 2004-09-14 |
| 6784541 | Semiconductor module and mounting method for same | Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2004-08-31 |
| 6686226 | Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame | Shigeharu Tsunoda, Junichi Saeki, Isamu Yoshida, Kazuya Ooji, Michiharu Honda +5 more | 2004-02-03 |
| 6639323 | Semiconductor device and its manufacturing method | Yukiharu Akiyama, Tomoaki Kudaishi, Takehiro Ohnishi, Noriou Shimada, Asao Nishimura +7 more | 2003-10-28 |
| 6627997 | Semiconductor module and method of mounting | Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh, Masahiko Ogino +3 more | 2003-09-30 |
| 6586105 | Packaging structure and method for automotive components | Masahiko Asano, Mutsumi Watanabe, Kunito Nakatsuru, Hiroatsu Tokuda | 2003-07-01 |
| 6515371 | Semiconductor device with elastic structure and wiring | Yukiharu Akiyama, Tomoaki Kudaishi, Takehiro Ohnishi, Noriou Shimada, Asao Nishimura +7 more | 2003-02-04 |
| 6433440 | Semiconductor device having a porous buffer layer for semiconductor device | Masahiko Ogino, Akira Nagai, Takumi Ueno, Masanori Segawa, Hiroyoshi Kokaku +6 more | 2002-08-13 |
| 6423571 | Method of making a semiconductor device having a stress relieving mechanism | Masahiko Ogino, Akira Nagai, Toshiaki Ishii, Masanori Segawa, Haruo Akahoshi +4 more | 2002-07-23 |
| 6371664 | Photoelectronic device and method of manufacturing the same | Shoichi Takahashi, Hiroshi Naka, Toshimasa Miura | 2002-04-16 |
| 6307269 | Semiconductor device with chip size package | Yukiharu Akiyama, Tomoaki Kudaishi, Takehiro Ohnishi, Noriou Shimada, Asao Nishimura +7 more | 2001-10-23 |