Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11044806 | Method for manufacturing multi-layer circuit board capable of being applied with electrical testing | Chin-Kuan Liu, Chao-Lung Wang, Yu-Te Lu, Chin-Hsi Chang | 2021-06-22 |
| 10548214 | Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same | Chin-Kuan Liu, Chao-Lung Wang, Yu-Te Lu, Chin-Hsi Chang | 2020-01-28 |
| 10455694 | Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing | Chin-Kuan Liu, Chao-Lung Wang, Yu-Te Lu, Chin-Hsi Chang | 2019-10-22 |
| 10334719 | Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same | Chin-Kuan Liu, Chao-Lung Wang, Yu-Te Lu, Chin-Hsi Chang | 2019-06-25 |
| 9831167 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Kuo-Chun Huang | 2017-11-28 |
| 9754870 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Kuo-Chun Huang | 2017-09-05 |
| 9406641 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Kuo-Chun Huang | 2016-08-02 |
| 7795722 | Substrate strip and substrate structure and method for manufacturing the same | Shu-Luan Chan, Chi-Chih Huang | 2010-09-14 |
| 7560650 | Substrate structure and method for manufacturing the same | Shu-Luan Chan, Chi-Chih Huang | 2009-07-14 |
| 7550375 | Method for forming metal bumps | Sheng-Ming Wang, Kuo-Hua Chang, Chi-Chih Huang, Chih-Cheng Chen | 2009-06-23 |