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Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same |
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Laser marked code pattern for representing tracing number of chip |
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Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same |
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Backlit switches |
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System-in-package image sensor |
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Panel carrier and method for attaching a liquid-crystal-on-silicon panel thereto |
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Trenched device wafer, stepped-sidewall device die, and associated method |
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System-in-package image sensor |
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Image sensor packages with folded cover-glass sealing interface |
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Curved image sensor systems |
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Curved image sensor systems and methods for manufacturing the same |
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Image sensing device and packaging method thereof |
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Image sensing device and packaging method thereof |
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Substrate structure and method for manufacturing the same |
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Method for forming metal bumps |
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