Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163954 | Trenched device wafer, stepped-sidewall device die, and associated method | Chi-Chih Huang, Wei-Feng Lin | 2018-12-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163954 | Trenched device wafer, stepped-sidewall device die, and associated method | Chi-Chih Huang, Wei-Feng Lin | 2018-12-25 |