Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8637973 | Packaged microelectronic components with terminals exposed through encapsulant | Eng Meow Koon, Low Siu Waf, Chan Min Yu, Chia Yong Poo, Zhou Wei | 2014-01-28 |
| 8138617 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2012-03-20 |
| 8115306 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Lou +4 more | 2012-02-14 |
| 7675169 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Waf, Chan Min Yu, Neo Yong Loo +4 more | 2010-03-09 |
| 7358154 | Method for fabricating packaged die | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2008-04-15 |
| 7195957 | Packaged microelectronic components | Eng Meow Koon, Low Siu Waf, Chan Min Yu, Chia Yong Poo, Zhou Wei | 2007-03-27 |
| 7170161 | In-process semiconductor packages with leadframe grid arrays | Chan Min Yu, Low Siu Waf, Chia Yong Poo, Eng Meow Koon | 2007-01-30 |
| 6967127 | Methods for making semiconductor packages with leadframe grid arrays | Chan Min Yu, Low Siu Waf, Chia Yong Poo, Eng Meow Koon | 2005-11-22 |
| 6894386 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2005-05-17 |
| 6836008 | Semiconductor packages with leadframe grid arrays and components | Chan Min Yu, Low Siu Waf, Chia Yong Poo, Eng Meow Koon | 2004-12-28 |
| 6836009 | Packaged microelectronic components | Eng Meow Koon, Low Siu Waf, Chan Min Yu, Chia Yong Poo, Zhou Wei | 2004-12-28 |