Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157824 | Integrated circuit (IC) package and package substrate comprising stacked vias | Kuiwon Kang, Houssam Jomaa, Layal Rouhana | 2018-12-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157824 | Integrated circuit (IC) package and package substrate comprising stacked vias | Kuiwon Kang, Houssam Jomaa, Layal Rouhana | 2018-12-18 |