Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8558396 | Bond pad configurations for semiconductor dies | Nikhil Vishwanath Kelkar, Seshasayee S. Ankireddi | 2013-10-15 |
| 6010951 | Dual side fabricated semiconductor wafer | Abdalla Aly Naem | 2000-01-04 |