Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784139 | Package substrate and semiconductor package including the same | Byungwook Kim, Ayoung KIM, Seongwon Jeong | 2023-10-10 |
| 11749630 | Interconnect structure and semiconductor chip including the same | Byungwook Kim, Ayoung KIM, Haeseong Jeong | 2023-09-05 |
| 11342283 | Package substrate and semiconductor package including the same | Byungwook Kim, Ayoung KIM, Seongwon Jeong | 2022-05-24 |
| 11068150 | Method for compensating for pressure value of force sensor and electronic device using same | Seonghun Kim, Jungsoo KIM, Taehoon Kim | 2021-07-20 |
| 9402315 | Semiconductor package having magnetic connection member | Hyunsuk Chun, Soojae Park, Seungbae Lee | 2016-07-26 |