Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784139 | Package substrate and semiconductor package including the same | Byungwook Kim, Ayoung KIM, Sangsu Ha | 2023-10-10 |
| 11640950 | Semiconductor chip and semiconductor package | Byungwook Kim, Ahram Kang | 2023-05-02 |
| 11342283 | Package substrate and semiconductor package including the same | Byungwook Kim, Ayoung KIM, Sangsu Ha | 2022-05-24 |