Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6002179 | Bonding pad structure for integrated circuit (I) | Chin-Jong Chan, Hsiu-Hsin Chung | 1999-12-14 |
| 5962919 | Bonding pad structure for integrated circuit (III) | Wen-Hao Liang, Chin-Jong Chan, Hsiu-Hsin Chung | 1999-10-05 |