Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6551916 | Bond-pad with pad edge strengthening structure | Shi-Tron Lin | 2003-04-22 |
| 6313541 | Bone-pad with pad edge strengthening structure | Shi-Tron Lin | 2001-11-06 |
| 6181016 | Bond-pad with a single anchoring structure | Shi-Tron Lin | 2001-01-30 |
| 6002179 | Bonding pad structure for integrated circuit (I) | Hsiu-Hsin Chung, Rueyway Lin | 1999-12-14 |
| 5962919 | Bonding pad structure for integrated circuit (III) | Wen-Hao Liang, Hsiu-Hsin Chung, Rueyway Lin | 1999-10-05 |
| 5471092 | Metallurgical joint including a stress release layer | Jei-Wei Chang, Lubomyr T. Romankiw | 1995-11-28 |