Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12372490 | Structurally reinforced sensor and method for manufacturing the same | Christina Pai, Brian P. McGee, Mohsen Askarinya, Mary Ellen B. Coe, Cynthia J. Jones +3 more | 2025-07-29 |
| 11448611 | Structurally reinforced sensor and method for manufacturing the same | Christina Pai, Brian P. McGee, Mohsen Askarinya, Mary Ellen B. Coe, Cynthia J. Jones +3 more | 2022-09-20 |
| 6002179 | Bonding pad structure for integrated circuit (I) | Chin-Jong Chan, Rueyway Lin | 1999-12-14 |
| 5962919 | Bonding pad structure for integrated circuit (III) | Wen-Hao Liang, Chin-Jong Chan, Rueyway Lin | 1999-10-05 |