Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5962919 | Bonding pad structure for integrated circuit (III) | Chin-Jong Chan, Hsiu-Hsin Chung, Rueyway Lin | 1999-10-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5962919 | Bonding pad structure for integrated circuit (III) | Chin-Jong Chan, Hsiu-Hsin Chung, Rueyway Lin | 1999-10-05 |