Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136585 | Compact power electronics module with increased cooling surface | Stefan Behrendt | 2024-11-05 |
| 12133366 | Power electronics module with improved cooling | Stefan Behrendt | 2024-10-29 |
| 12125817 | Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other | Martin Becker, André Bastos Abibe, Jacek Rudzki, Frank Osterwald, David Benning | 2024-10-22 |
| 11776932 | Process and device for low-temperature pressure sintering | Holger Ulrich | 2023-10-03 |
| 11626383 | Process and device for low-temperature pressure sintering | Holger Ulrich | 2023-04-11 |
| 11400514 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich | 2022-08-02 |
| 10832995 | Power module | Frank Osterwald | 2020-11-10 |
| 10814396 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich | 2020-10-27 |
| 10818633 | Sintering tool for the lower die of a sintering device | Frank Osterwald, Martin Becker, Jacek Rudzki, Lars Paulsen, Holger Ulrich | 2020-10-27 |
| 10685894 | Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component | — | 2020-06-16 |
| 10607962 | Method for manufacturing semiconductor chips | Frank Osterwald, Martin Becker, Holger Ulrich, Jacek Rudzki | 2020-03-31 |
| 10593608 | Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component | Anton-Zoran MIRIC, Frank Krüger, Wolfgang Schmitt | 2020-03-17 |
| 10483229 | Sintering device | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich | 2019-11-19 |
| 10438924 | Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module | Martin Becker, Frank Osterwald, Jacek Rudzki, Holger Ulrich | 2019-10-08 |
| 10403566 | Power module | Frank Osterwald | 2019-09-03 |
| 10381283 | Power semiconductor module | Frank Osterwald, Holger Ulrich | 2019-08-13 |
| 10332858 | Electronic sandwich structure with two parts joined together by means of a sintering layer | Martin Becker, Jacek Rudzki, Frank Osterwald | 2019-06-25 |
| 10306800 | Cooling trough, cooler and power module assembly | Franke Wulf-Toke, Reiner Hinken, Frank Osterwald, Klaus Olesen, Lars Paulsen | 2019-05-28 |
| 10079219 | Power semiconductor contact structure and method for the production thereof | Martin Becker, Frank Osterwald, Jacek Rudzki | 2018-09-18 |
| 9786627 | Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips | Martin Becker, Frank Osterwald, Jacek Rudzki | 2017-10-10 |
| 9613929 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Frank Osterwald, Jacek Rudzki | 2017-04-04 |
| 9318421 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Frank Osterwald, Jacek Rudzki | 2016-04-19 |
| 9287232 | Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner | Mathias Kock | 2016-03-15 |
| 9040338 | Power semiconductor module with method for manufacturing a sintered power semiconductor module | — | 2015-05-26 |
| 8802564 | Method of manufacturing a semiconductor component | Mathias Kock | 2014-08-12 |