Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9235747 | Integrated leadframe and bezel structure and device formed from same | Alan Kramer, Giovanni Gozzini | 2016-01-12 |
| 8836478 | Electronic device including finger sensor and related methods | Giovanni Gozzini | 2014-09-16 |
| 8803258 | Finger sensor including capacitive lens and associated methods | Giovanni Gozzini | 2014-08-12 |
| 8772884 | Integrally molded die and bezel structure for fingerprint sensors and the like | Alan Kramer, Giovanni Gozzini | 2014-07-08 |
| 8582837 | Pseudo-translucent integrated circuit package | Alan Kramer, Giovanni Gozzini | 2013-11-12 |
| 8569875 | Integrally molded die and bezel structure for fingerprint sensors and the like | Alan Kramer, Giovanni Gozzini | 2013-10-29 |
| 8471345 | Biometric sensor assembly with integrated visual indicator | Alan Kramer, Giovanni Gozzini | 2013-06-25 |
| 8378508 | Integrally molded die and bezel structure for fingerprint sensors and the like | Alan Kramer, Giovanni Gozzini | 2013-02-19 |
| D652332 | Molded fingerprint sensor structure with indicia regions | Alan Kramer, Giovanni Gozzini | 2012-01-17 |
| D652333 | Molded fingerprint sensor structure | Alan Kramer, Giovanni Gozzini | 2012-01-17 |
| 7456050 | System and method for controlling integrated circuit die height and planarity | Harry Michael Siegel, Tom Lao | 2008-11-25 |
| 6889813 | Material transport method | Harold L. Trammell | 2005-05-10 |
| 5994774 | Surface mountable integrated circuit package with detachable module and interposer | Harry Michael Siegel, Michael J. Hundt | 1999-11-30 |
| 5991156 | Ball grid array integrated circuit package with high thermal conductivity | Michael J. Hundt | 1999-11-23 |
| 5724728 | Method of mounting an integrated circuit to a mounting surface | Harry Michael Siegel | 1998-03-10 |
| 5693572 | Ball grid array integrated circuit package with high thermal conductivity | Michael J. Hundt | 1997-12-02 |
| 5642265 | Ball grid array package with detachable module | Harry Michael Siegel | 1997-06-24 |
| 5642261 | Ball-grid-array integrated circuit package with solder-connected thermal conductor | Michael J. Hundt | 1997-06-24 |
| 5182851 | Method for holding a strip of conductive lead frames | Michael A. Olla, Barry L. Morrison, Linn C. Garrison | 1993-02-02 |
| 5111935 | Universal leadframe carrier | Michael A. Olla, Barry L. Morrison, Linn C. Garrison | 1992-05-12 |
| 4926538 | Universal nest for a connector assembly tool | Ivan Pawlenko | 1990-05-22 |
| 4915565 | Manipulation and handling of integrated circuit dice | Steven Swendrowski, Michael A. Olla, Barry L. Morrison | 1990-04-10 |
| 4860816 | Control system for vibratory apparatus | — | 1989-08-29 |
| 4815595 | Uniform leadframe carrier | Michael A. Olla, Barry L. Morrison, Linn C. Garrison | 1989-03-28 |
| 4759675 | Chip selection in automatic assembly of integrated circuit | Steven Swendrowski, Michael A. Olla, Barry L. Morrison, Ricky Parkinson, Linn C. Garrison +1 more | 1988-07-26 |