Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183620 | Apparatus and method for bonding a plurality of dies to a carrier panel | Hwee-Seng Jimmy Chew, Amlan Sen, Li Jiang Huang, Siew Wen Lee, Wai Hoe Lee +1 more | 2024-12-31 |
| 11817326 | Precision reconstruction for panel-level packaging | Amlan Sen, Chian Soon Chua, Wai Hoe Lee | 2023-11-14 |
| 11552043 | Post bond inspection of devices for panel packaging | Amlan Sen, Chian Soon Chua, Wai Hoe Lee | 2023-01-10 |
| 6964802 | Surface finishing compression molding with multi-layer extrusion | Arthur Delusky, Stephen McCarthy, Robert Lucke, Thomas M. Ellison | 2005-11-15 |
| 6770230 | Surface finishing compression molding with multi-layer extrusion | Arthur Delusky, Stephen McCarthy, Robert Lucke, Thomas M. Ellison | 2004-08-03 |
| 6670028 | Molded article and process for preparing same | Thomas M. Ellison, Stephen McCarthy, Arthur Delusky | 2003-12-30 |