Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334444 | Semiconductor package structure and method for forming the same | Yi-Jou Lin, Hung-Chuan Chen | 2025-06-17 |
| 12249599 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Hsien-Che Lin, Ying-Chieh Ke +1 more | 2025-03-11 |
| 11646302 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Hsien-Che Lin, Ying-Chieh Ke +1 more | 2023-05-09 |
| 11458208 | Desmoglein 2 antibody fusion proteins for drug delivery | Min-Che Chen, Ya-chuan Liu, Ya-ping Tsai, Chun-Wei Chen, Pei-Yi Lee | 2022-10-04 |
| 11342267 | Semiconductor package structure and method for forming the same | Yi-Jou Lin, Hung-Chuan Chen | 2022-05-24 |
| 10836823 | Dsg2 monoclonal antibody and the applications thereof | Min-Che Chen, Ya-chuan Liu | 2020-11-17 |