Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12249599 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Po-Hao Chang, Ying-Chieh Ke +1 more | 2025-03-11 | |
| 11646302 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Po-Hao Chang, Ying-Chieh Ke +1 more | 2023-05-09 | $324,008,000 |