Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659900 | Semiconductor device having a die and through-substrate via | Xuejun Ying, Arkadii V. Samoilov, Tyler Parent | 2017-05-23 |
| 9196587 | Semiconductor device having a die and through substrate-via | Xuejun Ying, Arkadii V. Samoilov, Tyler Parent | 2015-11-24 |
| 5354386 | Method for plasma etching tapered and stepped vias | David Cheung, Norman E. Abt | 1994-10-11 |