Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237305 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Richard Patten | 2025-02-25 |
| 10319688 | Antenna on ceramics for a packaged die | Andreas Wolter, Saravana Maruthamuthu, Mikael Bergholz Knudsen, Thorsten Meyer, Georg Seidemann +1 more | 2019-06-11 |
| 10249598 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Richard Patten | 2019-04-02 |
| 9972601 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Richard Patten | 2018-05-15 |
| 9819327 | Bulk acoustic wave resonator tuner circuits | Saravana Maruthamuthu, Thorsten Meyer, Pablo Herrero, Andreas Wolter, Georg Seidemann +1 more | 2017-11-14 |
| 8779564 | Semiconductor device with capacitive coupling structure | Mikael Bergholz Knudsen, Thorsten Meyer, Saravana Maruthamuthu, Andreas Wolter, Georg Seidemann +1 more | 2014-07-15 |