Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12311441 | Method for manufacturing a multi-material part by additive manufacturing, using the technique of powder bed selective laser melting or selective laser sintering | Frédéric Veron, Philippe Tailhades, Valérie Baco-Carles, Kateryna Kiryukhina | 2025-05-27 |
| 12126525 | Redundancy matrix-based system | Thomas J. Robe, Thierry Adam, Benjamin Therond | 2024-10-22 |
| 11258147 | Assembly comprising a sleeve connecting first and second hollow waveguides, wherein grooves for receiving reversible deformable elements therein are located waveguides and sleeve | Bertrand Brevart, Gilbert Fouctiere, Stéphane Forestier, Didier Dupuy, Brandon Grant | 2022-02-22 |
| 10340567 | Microwave switching device with the state of the connections of the inputs and outputs being read by telemetry | Raoul Rodriguez, Pierre-Yves Chabaud, Dominique Potuaud, Jérôme Battut, Johann Bornet +3 more | 2019-07-02 |
| 9232631 | Hyperfrequency interconnection device | David Nevo, Antoine Renel, Beatrice Espana | 2016-01-05 |
| 9108277 | Process for manufacturing a device comprising brazes produced from metal oxalate | Lidwine Raynaud, Valérie BACO, Michel Gougeon, Hoa LE TRONG, Philippe Tailhades | 2015-08-18 |
| 8850698 | Method for the sealed assembly of an electronic housing | Claude Drevon, Walim Ben Naceur | 2014-10-07 |
| 6754405 | Electronic assembly having high interconnection density | Marc Huan, Sylvain Paineau | 2004-06-22 |
| 6730997 | Method of transferring ultra-thin substrates and application of the method to the manufacture of a multi-layered thin film device | Eric Beyne, Augustin Coello-Vera | 2004-05-04 |
| 6683373 | Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby | Norbert Venet, Philippe Calvel, Stéphane Albinet, Jean-Cyril Esther, Marc Huan | 2004-01-27 |