NT

Noriyuki Taguchi

HI Hitachi: 7 patents #5,859 of 28,497Top 25%
HC Hitachi Chemical Company: 6 patents #259 of 1,946Top 15%
PA Panasonic: 4 patents #6,180 of 21,108Top 30%
Overall (All Time): #257,581 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
9190591 Ultraviolet irradiation head and ultraviolet irradiator Akihiro Tahara, Tsuyoshi Inui, Yoshiyuki Nakazono, Kanto Imai 2015-11-17
7543546 Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method Tetsuji Shibata, Keiichi Yamazaki, Yasushi Sawada 2009-06-09
7273652 Hollow carbon fiber and production method Shinji Takeda, Kazumi Kokaji, Osamu Hirai 2007-09-25
7239261 Electromagnetic wave absorption material and an associated device Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara 2007-07-03
7187072 Fabrication process of semiconductor package and semiconductor package Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more 2007-03-06
6818821 Electromagnetic wave absorption material and an associated device Tadashi Fujieda, Kishio Hidaka, Shinzou Ikeda, Mitsuo Hayashibara 2004-11-16
6746897 Fabrication process of semiconductor package and semiconductor package Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more 2004-06-08
6743500 Hollow carbon fiber and production method Shinji Takeda, Kazumi Kokaji, Osamu Hirai 2004-06-01
6670766 Plasma treatment apparatus and plasma treatment method Keiichi Yamazaki, Yukiko Inooka, Yasushi Sawada, Yoshiyuki Nakazono, Akio Nakano 2003-12-30
6641792 Hollow carbon fiber and production method Shinji Takeda, Kazumi Kokaji, Osamu Hirai 2003-11-04
6465964 Plasma treatment apparatus and plasma generation method using the apparatus Yasushi Sawada, Keiichi Yamazaki, Yoshiyuki Nakazono, Yukiko Inooka, Kazuya KITAYAMA 2002-10-15
6365432 Fabrication process of semiconductor package and semiconductor package Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more 2002-04-02
5976912 Fabrication process of semiconductor package and semiconductor package Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata +2 more 1999-11-02
5166824 Rear projection screen and manufacturing method therefor as well as molding die for shaping rear projection screen, overhead projector and projection television set Takashi Nishiguchi, Masami Masuda 1992-11-24
4465727 Ceramic wiring boards Tsuyoshi Fujita, Gyozo Toda, Takashi Kuroki, Shoosaku Ishihara 1984-08-14
4464420 Ceramic multilayer circuit board and a process for manufacturing the same Tsuyoshi Fuzita, Gyozo Toda, Syoosaku Ishihara, Takashi Kuroki, Tatsuhiro Suzuki 1984-08-07
4308571 Low temperature-sinterable dielectric composition and thick film capacitor using the same Hirayoshi Tanei, Akira Ikegami, Katsuo Abe, Hiroshi Ohtsu, Tokio Isogai 1981-12-29
4220547 Dielectric paste for thick film capacitor Katsuo Abe, Nobuyuki Sugishita, Tokio Isogai 1980-09-02