Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10718907 | Holding member and optical module | — | 2020-07-21 |
| 10586770 | Optical module | Takayoshi Matsumura, Naoaki Nakamura, Takashi Kubota, Kenji Fukuzono, Takumi Masuyama +2 more | 2020-03-10 |
| 10444450 | Optical module | Takayoshi Matsumura, Naoaki Nakamura, Kenji Fukuzono, Takashi Kubota, Takumi Masuyama +2 more | 2019-10-15 |
| 10261249 | Optical module and method of manufacturing optical module | Naoaki Nakamura, Kenji Fukuzono | 2019-04-16 |
| 10103510 | Optical module and method of manufacturing optical module | Naoaki Nakamura | 2018-10-16 |
| 10103126 | Laminated semiconductor device and manufacturing method of laminated semiconductor device | Hidehiko Kira | 2018-10-16 |
| 9793221 | Semiconductor device mounting method | Hidehiko Kira, Takashi Kubota, Takumi Masuyama | 2017-10-17 |
| 9719848 | Optical module, method for manufacturing optical module, and optical transceiver | Takashi Kubota | 2017-08-01 |
| 9547126 | Optical waveguide sheet, optical unit, and method for manufacturing the same | Sanae Iijima, Takashi Kubota, Hidehiko Kira | 2017-01-17 |
| 9536857 | Heating header of semiconductor mounting apparatus and bonding method for semiconductor | Hidehiko Kira, Takumi Masuyama | 2017-01-03 |
| 9453973 | Fabrication method for optical connector and optical connector | Takashi Kubota, Sanae Iijima, Hidehiko Kira | 2016-09-27 |
| 9013048 | Semiconductor device manufacturing method and semiconductor device | — | 2015-04-21 |
| 8076233 | Method of forming electrode connecting portion | Kuniko Ishikawa, Kenji Kobae | 2011-12-13 |
| 7833831 | Method of manufacturing an electronic component and an electronic device | Kuniko Ishikawa, Hidehiko Kira | 2010-11-16 |
| 7828193 | Method of mounting an electronic component and mounting apparatus | Kuniko Ishikawa, Hidehiko Kira | 2010-11-09 |
| 7712650 | Method of mounting a semiconductor chip | Takayoshi Matsumura, Kenji Kobae, Kimio Nakamura | 2010-05-11 |
| 7566586 | Method of manufacturing a semiconductor device | Hidehiko Kira, Kenji Kobae, Kimio Nakamura, Kuniko Ishikawa, Yukio Ozaki | 2009-07-28 |
| 7514788 | Structure of mounting electronic component | Kenji Kobae, Hidehiko Kira, Takayoshi Matsumura | 2009-04-07 |
| 7507654 | Method for mounting electronic element on a circuit board | Kenji Kobae, Hidehiko Kira, Takayoshi Matsumura | 2009-03-24 |
| 7471081 | Slider tester | Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi, Shuichi Takeuchi, Takayoshi Matsumura +3 more | 2008-12-30 |
| 7436062 | Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method | Shunji Baba, Hidehiko Kira, Toru Okada | 2008-10-14 |
| 7424966 | Method of ultrasonic mounting and ultrasonic mounting apparatus using the same | Hidehiko Kira, Kenji Kobae, Takayoshi Matsumura | 2008-09-16 |
| 7416921 | Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin | Hidehiko Kira, Kenji Kobae, Takayoshi Matsumura, Kimio Nakamura | 2008-08-26 |
| 7394163 | Method of mounting semiconductor chip | Shunji Baba, Takatoyo Yamakami, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2008-07-01 |
| 7355285 | Structure of mounting electronic component | Kenji Kobae, Hidehiko Kira, Takayoshi Matsumura | 2008-04-08 |