| 7777288 |
Integrated circuit device and fabrication method therefor |
Naoyoshi Kawahara, Hiroshi Murase, Hiroaki Ohkubo, Kuniko Kikuta, Yasutaka Nakashiba +2 more |
2010-08-17 |
| 7741692 |
Integrated circuit device with temperature monitor members |
Hiroaki Ohkubo, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase, Naoki Oda +1 more |
2010-06-22 |
| 7462921 |
Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film |
Naoyoshi Kawahara, Hiroshi Murase, Hiroaki Ohkubo, Yasutaka Nakashiba, Naoki Oda +1 more |
2008-12-09 |
| 7391092 |
Integrated circuit including a temperature monitor element and thermal conducting layer |
Hiroaki Ohkubo, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase, Naoki Oda +1 more |
2008-06-24 |
| 7239002 |
Integrated circuit device |
Hiroaki Ohkubo, Kuniko Kikuta, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase +2 more |
2007-07-03 |
| 6573607 |
Semiconductor device and manufacturing method thereof |
Yoshihisa Matsubara |
2003-06-03 |
| 6538719 |
Exposure apparatus and exposure method, and device and method for producing the same |
Masato Takahashi |
2003-03-25 |
| 6512281 |
Method of forming a semiconductor device and an improved deposition system |
— |
2003-01-28 |
| 6465354 |
Method of improving the planarization of wiring by CMP |
Kazumi Sugai, Hiroaki Tachibana |
2002-10-15 |
| 6372114 |
Method of forming a semiconductor device |
— |
2002-04-16 |
| 6317221 |
Image reading device and method |
Toshiya Aikawa, Toru Ochiai, Yoshitaka Araki, Eisaku Maeda, Nobuhiro Fujinawa +4 more |
2001-11-13 |
| 6309970 |
Method of forming multi-level copper interconnect with formation of copper oxide on exposed copper surface |
Yoshihisa Matsubara |
2001-10-30 |
| 6268090 |
Process for manufacturing semiconductor device and exposure mask |
Yoshihisa Matsubara, Kazumi Sugai, Kazuyoshi Ueno |
2001-07-31 |
| 6252234 |
Reaction force isolation system for a planar motor |
Andrew J. Hazelton, Keiichi Tanaka, Yutaka Hayashi |
2001-06-26 |
| 5543357 |
Process of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metal |
Yoshiaki Yamada, Kuniko Miyakawa, Michiko Yamanaka |
1996-08-06 |
| 5155063 |
Method of fabricating semiconductor device including an Al/TiN/Ti contact |
— |
1992-10-13 |