Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12127338 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Mikael Tuominen, Seok Kim Tay | 2024-10-22 |
| 12058810 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Mikael Tuominen, Seok Kim Tay | 2024-08-06 |
| 11672079 | Component carrier with improved bending performance | Mikael Tuominen | 2023-06-06 |
| 11670613 | Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method | Mikael Tuominen, Seok Kim Tay | 2023-06-06 |
| 11589462 | Semi-flexible component carrier with stepped layer structure | Mikael Tuominen, Seok Kim Tay | 2023-02-21 |
| 11291119 | Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus | Mikael Tuominen, Seok Kim Tay | 2022-03-29 |
| 11284508 | Semi-flex component carrier with dielectric material having high elongation and low young modulus | Mikael Tuominen, Seok Kim Tay | 2022-03-22 |
| 11219120 | Stress relief opening for reducing warpage of component carriers | Mikael Tuominen, Artan Baftiri | 2022-01-04 |
| 11116075 | Component carrier comprising dielectric structures with different physical properties | Kim Liu, Howard Li, Henry Guo | 2021-09-07 |