Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6531774 | Chip scale electrical test fixture with isolation plate having a recess | John Vu | 2003-03-11 |
| 6512675 | Heat sink grounded to a grounded package lid | Thomas S. Tarter, Eric Tosaya, Tom Ley, Shrikar Bhagath | 2003-01-28 |
| 6476625 | Method for determining coplanarity of electrical contact of BGA type packages prior to electrical characterization | — | 2002-11-05 |
| 6424140 | Chip scale electrical test fixture | Thomas S. Tarter | 2002-07-23 |
| 6396296 | Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station | Thomas S. Tarter | 2002-05-28 |
| 6384618 | Chip scale electrical test fixture with isolation plate having an angled test hole | John W. Pursel, John Vu | 2002-05-07 |