Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8324733 | Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same | In-Young Lee, Donghyeon Jang | 2012-12-04 |
| 8026592 | Through-silicon via structures including conductive protective layers | Minseung Yoon, Pyoungwan Kim, Keumhee Ma, Chajea Jo | 2011-09-27 |