Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142550 | Multi-chip module leadless package | Matthew David Romig, Wei Zhang, Peter Anthony Fundaro | 2024-11-12 |
| 11855001 | Leadless leadframe and semiconductor device package therefrom | David Chin, Dorothy Lyou Mantle | 2023-12-26 |
| 11569154 | Interdigitated outward and inward bent leads for packaged electronic device | Anis Fauzi Bin Abdul Aziz | 2023-01-31 |
| 11538741 | Multi-chip module leadless package | Matthew David Romig, Wei Zhang, Peter Anthony Fundaro | 2022-12-27 |
| 11410913 | Multi-layer die attachment | Steven Murphy, Leslie Edward Stark | 2022-08-09 |
| 10636727 | Multi-layer die attachment | Steven Murphy, Leslie Edward Stark | 2020-04-28 |