Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394169 | Optical sensor mechanism capable of mitigating signal nonlinearity | — | 2025-08-19 |
| 12148723 | Structure of semiconductor device | Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Chien-En Hsu | 2024-11-19 |
| 12068234 | Semiconductor structure | Chun-Hung Chen | 2024-08-20 |
| 11699646 | Semiconductor structure | Chun-Hung Chen | 2023-07-11 |
| 11569188 | Semiconductor device including elongated bonding structure between the substrate | Chung-Hsing Kuo, Chun-Ting Yeh | 2023-01-31 |
| 11557558 | Structure of semiconductor device and method for bonding two substrates | Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Chien-En Hsu | 2023-01-17 |
| 11482485 | Semiconductor structure | Chun-Hung Chen | 2022-10-25 |
| 11450633 | Package structure of semiconductor device with improved bonding between the substrates | Chung-Hsing Kuo, Hui-Ling Chen | 2022-09-20 |
| 11164822 | Structure of semiconductor device and method for bonding two substrates | Chung-Hsing Kuo, Chun-Ting Yeh, Hui-Ling Chen, Chien-Ming Lai | 2021-11-02 |
| 10886241 | Semiconductor package structure | Chun-Hung Chen, Chu-Fu Lin | 2021-01-05 |
| 10818616 | Semiconductor package structure and method for forming the same | Chun-Hung Chen, Chu-Fu Lin | 2020-10-27 |
| 10790248 | Three-dimensional integrated circuit and method of manufacturing the same | Chun-Hung Chen | 2020-09-29 |
| 10504821 | Through-silicon via structure | Chu-Fu Lin, Kuei-Sheng Wu | 2019-12-10 |
| 10340231 | Semiconductor package structure and method for forming the same | Chun-Hung Chen, Chu-Fu Lin | 2019-07-02 |
| 10325873 | Chip-stack structure | — | 2019-06-18 |
| 10192808 | Semiconductor structure | Teng-Chuan Hu, Chun-Hung Chen, Chu-Fu Lin, Chun-Ting Yeh, Chung-Hsing Kuo | 2019-01-29 |
| 10153252 | Wafer to wafer structure and method of fabricating the same | — | 2018-12-11 |
| 9978666 | Method for fabrication semiconductor device with through-substrate via | Kuei-Sheng Wu | 2018-05-22 |
| 9761509 | Semiconductor device with throgh-substrate via and method for fabrication the semiconductor device | Kuei-Sheng Wu | 2017-09-12 |
| 9748167 | Silicon interposer, semiconductor package using the same, and fabrication method thereof | — | 2017-08-29 |
| 9666507 | Through-substrate structure and method for fabricating the same | Chun-Hung Chen, Chien-Li Kuo | 2017-05-30 |
| 9478496 | Wafer to wafer structure and method of fabricating the same | — | 2016-10-25 |
| 9437491 | Method of forming chip with through silicon via electrode | Chu-Fu Lin, Chien-Li Kuo, Yung-Chang Lin | 2016-09-06 |
| 9412686 | Interposer structure and manufacturing method thereof | Kuei-Sheng Wu, Chien-Li Kuo | 2016-08-09 |
| 9343359 | Integrated structure and method for fabricating the same | Chun-Hung Chen, Yung-Chang Lin, Chien-Li Kuo | 2016-05-17 |