Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148723 | Structure of semiconductor device | Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Ming-Tse Lin, Chien-En Hsu | 2024-11-19 |
| 11569188 | Semiconductor device including elongated bonding structure between the substrate | Chung-Hsing Kuo, Ming-Tse Lin | 2023-01-31 |
| 11557558 | Structure of semiconductor device and method for bonding two substrates | Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Ming-Tse Lin, Chien-En Hsu | 2023-01-17 |
| 11164822 | Structure of semiconductor device and method for bonding two substrates | Chung-Hsing Kuo, Ming-Tse Lin, Hui-Ling Chen, Chien-Ming Lai | 2021-11-02 |
| 10192808 | Semiconductor structure | Teng-Chuan Hu, Chun-Hung Chen, Chu-Fu Lin, Chung-Hsing Kuo, Ming-Tse Lin | 2019-01-29 |
| 8158261 | Glass-ceramic composite encapsulation material | Sea-Fue Wang, Yun Wang, Ching-Chin Chuang | 2012-04-17 |
| 8106119 | Thermally conductive silicone composition | Sea-Fue Wang, Yuh-Ruey Wang, Hsi-Chuan Lu | 2012-01-31 |
| 8101092 | Method for controlling ADI-AEI CD difference ratio of openings having different sizes | Chih-Wen Feng, Pei-Yu Chou, Jyh-Cherng Yau, Jiunn-Hsiung Liao, Feng-Yi Chang +1 more | 2012-01-24 |