Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9012264 | Integrated circuit package including embedded thin-film battery | Haibin Du, Krishnan Kelappan, Frank J. Sigmund | 2015-04-21 |
| 8766435 | Integrated circuit package including embedded thin-film battery | Haibin Du, Krishnan Kelappan, Frank J. Sigmund | 2014-07-01 |
| 8163220 | Method of packaging integrated circuits | Tiao Zhou | 2012-04-24 |
| 7402454 | Molded integrated circuit package with exposed active area | Tiao Zhou | 2008-07-22 |
| 7315079 | Thermally-enhanced ball grid array package structure and method | Tiao Zhou | 2008-01-01 |
| 7304362 | Molded integrated circuit package with exposed active area | Tiao Zhou | 2007-12-04 |
| 7244967 | Apparatus and method for attaching an integrating circuit sensor to a substrate | Tiao Zhou | 2007-07-17 |
| 7180175 | Thermally-enhanced ball grid array package structure and method | Tiao Zhou | 2007-02-20 |
| 6817854 | Mold with compensating base | Tiao Zhou | 2004-11-16 |
| 6815262 | Apparatus and method for attaching an integrated circuit sensor to a substrate | Tiao Zhou | 2004-11-09 |
| 6686227 | Method and system for exposed die molding for integrated circuit packaging | Tiao Zhou | 2004-02-03 |
| 6586821 | Lead-frame forming for improved thermal performance | Tiao Zhou | 2003-07-01 |
| 6372543 | Wrap-around interconnect for fine pitch ball grid array | Anthony M. Chiu, Tom Lao, Harry Michael Siegel | 2002-04-16 |
| 6121678 | Wrap-around interconnect for fine pitch ball grid array | Anthony M. Chiu, Tom Lao, Harry Michael Siegel | 2000-09-19 |
| 6113399 | Low-profile socketed packaging system with land-grid array and thermally conductive slug | Anthony M. Chiu | 2000-09-05 |
| 6028773 | Packaging for silicon sensors | — | 2000-02-22 |
| 5994774 | Surface mountable integrated circuit package with detachable module and interposer | Harry Michael Siegel, Robert H. Bond | 1999-11-30 |
| 5991156 | Ball grid array integrated circuit package with high thermal conductivity | Robert H. Bond | 1999-11-23 |
| 5805419 | Low-profile socketed packaging system with land-grid array and thermally conductive slug | Anthony M. Chiu | 1998-09-08 |
| 5711069 | Method of making an integrated circuit package with flat-topped heat sink | — | 1998-01-27 |
| 5693572 | Ball grid array integrated circuit package with high thermal conductivity | Robert H. Bond | 1997-12-02 |
| 5677247 | Low-profile socketed packaging system with land-grid array and thermally conductive slug | Anthony M. Chiu | 1997-10-14 |
| 5642261 | Ball-grid-array integrated circuit package with solder-connected thermal conductor | Robert H. Bond | 1997-06-24 |
| 5610800 | Substrate mounting of circuit components with a low profile | Harry Michael Siegel | 1997-03-11 |
| 5590462 | Process for dissipating heat from a semiconductor package | Carlo Cognetti | 1997-01-07 |