Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057434 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2024-08-06 |
| 11488934 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2022-11-01 |
| 10872879 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2020-12-22 |
| 10388582 | Semiconductor device and manufacturing method thereof | Young Rae Kim, Won Chul Do, Ji Hun Lee, Min Hwa Chang, Dong Hyun Kim +2 more | 2019-08-20 |
| 10163867 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2018-12-25 |
| 9941180 | Semiconductor device and manufacturing method thereof | Young Rae Kim, Won Chul Do, Ji Hun Lee, Min Hwa Chang, Dong Hyun Kim +2 more | 2018-04-10 |
| 9935083 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, Jin Seong Kim | 2018-04-03 |