Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615873 | Solder flow stops for semiconductor die substrates | George Pearson | 2009-11-10 |
| 7573107 | Power module | Alberto Guerra, Norman Connah, George Pearson | 2009-08-11 |
| 6255722 | High current capacity semiconductor device housing | Peter R. Ewer | 2001-07-03 |
| 5902959 | Lead frame with waffled front and rear surfaces | Peter R. Ewer, Alex Kamara, Kevin Smith, Arthur Woodworth | 1999-05-11 |