Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667547 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Arthur Woodworth, Ken Teasdale | 2003-12-23 |
| 6512304 | Nickel-iron expansion contact for semiconductor die | — | 2003-01-28 |
| 6476481 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Arthur Woodworth, Ken Teasdale | 2002-11-05 |
| 6465875 | Semiconductor device package with plural pad lead frame | Glyn Connah | 2002-10-15 |
| 6396091 | Chip scale package | — | 2002-05-28 |
| 6348727 | High current semiconductor device package with plastic housing and conductive tab | Paul Westmarland, Alberto Guerra | 2002-02-19 |
| 6281096 | Chip scale packaging process | — | 2001-08-28 |
| 6255722 | High current capacity semiconductor device housing | Mark Steers | 2001-07-03 |
| 6204554 | Surface mount semiconductor package | Arthur Woodworth | 2001-03-20 |
| 6078098 | Crushable bead on lead finger side surface to improve moldability | — | 2000-06-20 |
| 6075286 | Stress clip design | — | 2000-06-13 |
| 5977630 | Plural semiconductor die housed in common package with split heat sink | Arthur Woodworth, George Tyler Pearson | 1999-11-02 |
| 5902959 | Lead frame with waffled front and rear surfaces | Alex Kamara, Kevin Smith, Mark Steers, Arthur Woodworth | 1999-05-11 |
| 5886397 | Crushable bead on lead finger side surface to improve moldability | — | 1999-03-23 |
| 5763949 | Surface-mount semiconductor package | Arthur Woodworth | 1998-06-09 |
| 5760472 | Surface mount semiconductor package | Arthur Woodworth | 1998-06-02 |
| 4965710 | Insulated gate bipolar transistor power module | Brian R. Pelly, Ajit Dubhashi | 1990-10-23 |
| 4853762 | Semi-conductor modules | Jeffrey R. Ellard | 1989-08-01 |