| 6667547 |
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
Arthur Woodworth, Ken Teasdale |
2003-12-23 |
| 6512304 |
Nickel-iron expansion contact for semiconductor die |
— |
2003-01-28 |
| 6476481 |
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
Arthur Woodworth, Ken Teasdale |
2002-11-05 |
| 6465875 |
Semiconductor device package with plural pad lead frame |
Glyn Connah |
2002-10-15 |
| 6396091 |
Chip scale package |
— |
2002-05-28 |
| 6348727 |
High current semiconductor device package with plastic housing and conductive tab |
Paul Westmarland, Alberto Guerra |
2002-02-19 |
| 6281096 |
Chip scale packaging process |
— |
2001-08-28 |
| 6255722 |
High current capacity semiconductor device housing |
Mark Steers |
2001-07-03 |
| 6204554 |
Surface mount semiconductor package |
Arthur Woodworth |
2001-03-20 |
| 6078098 |
Crushable bead on lead finger side surface to improve moldability |
— |
2000-06-20 |
| 6075286 |
Stress clip design |
— |
2000-06-13 |
| 5977630 |
Plural semiconductor die housed in common package with split heat sink |
Arthur Woodworth, George Tyler Pearson |
1999-11-02 |
| 5902959 |
Lead frame with waffled front and rear surfaces |
Alex Kamara, Kevin Smith, Mark Steers, Arthur Woodworth |
1999-05-11 |
| 5886397 |
Crushable bead on lead finger side surface to improve moldability |
— |
1999-03-23 |
| 5763949 |
Surface-mount semiconductor package |
Arthur Woodworth |
1998-06-09 |
| 5760472 |
Surface mount semiconductor package |
Arthur Woodworth |
1998-06-02 |
| 4965710 |
Insulated gate bipolar transistor power module |
Brian R. Pelly, Ajit Dubhashi |
1990-10-23 |
| 4853762 |
Semi-conductor modules |
Jeffrey R. Ellard |
1989-08-01 |